Load lock fast pump vent

ABSTRACT

A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. Non-provisional patentapplication Ser. No. 12/123,365, filed May 19, 2008 (now U.S. Pat. No.8,272,825), which claims the benefit of U.S. Provisional PatentApplication No. 60/938,922, filed on May 18, 2007, the disclosure ofwhich is incorporated by reference herein in its entirety.

BACKGROUND

1. Field

The exemplary embodiments generally relate to controlled atmosphereenvironments and, more particularly, to increasing throughput in thoseenvironments.

2. Brief Description of Related Developments

Increased efficiencies are sought in the production electronics, andparticularly in the production of semiconductor devices that form aneven increasing part of electronics.

To optimize throughput of hot wafers using static loadlock coolingshelves, through a cluster tool while minimizing the part count andcomplexity of the assembly, particularly eliminating any motion/deviceinside the loadlock. To achieve higher throughputs in a cluster tool,multiple loadlocks modules are used conventionally. This increasesequipment complexity and cost to end users.

Generally in semiconductor processing systems atmospheric doors areutilized to seal the wafer slit opening between, for example, a loadlock and an atmospheric interface such as that found on an EquipmentFront End Module (EFEM) or load port module. The atmospheric doors aregenerally pneumatically driven in a move vertically into place over theslit opening. The atmospheric doors are then driven into contact withthe load lock seal contact surface surrounding the slit opening to sealthe opening from an outside atmosphere.

In sealing against the load lock contact surface, worn door seals,faulty door motion and foreign debris can damage the load lock contactsurface causing leaks into the load lock chamber when the load lockchamber is pumped down. The repair of the load lock seal contact surfaceis time and labor extensive in that the surface must be re-machined orsanded to create the original surface condition. The reworking of theseal contact surface can take many hours and cause extensive down timeof the processing tool. Where the seal contact surface is beyond repairthe load lock is replaced.

It would be advantageous to have an atmospheric door contact surface ona load lock that can be quickly replaced to minimize process tooldowntime.

Protection of the substrate from particle contamination during transferfrom, for example a process module to a load port module and vice versain an important task for the manufacture of semiconductor substrates. Inorder to minimize substrate contamination all of the moving parts of thesubstrate transport module are generally positioned below the substratepath.

Generally, atmospheric doors and slot valves used on substrateprocessing equipment including, but not limited to, load locks arelocated below the substrate transfer plane to minimize substrateairborne particle contamination. In the case of, for example, a stackedor double load lock atmospheric doors and slot valves are mounted on theload lock upside down above the substrate transfer plane such that thedoor actuators are located in the substrate transfer zone. Having thedoor actuators above the substrate transfer plane creates a highprobability of substrate particle contamination due to the dooractuators.

It would be advantageous to have an atmospheric door that has actuatorsthat are not located above substrate transfer plane or within thesubstrate transfer zone such that substrate particle contamination isminimized.

SUMMARY OF THE EXEMPLARY EMBODIMENTS

In one aspect of the disclosed embodiment, a semiconductor processingtool is disclosed. The semiconductor processing tool having a frameforming at least one chamber with an opening and having a sealingsurface around a periphery of the opening, a door configured to interactwith the sealing surface for sealing the opening, the door having sidessubstantially perpendicular to the door sealing surface andsubstantially perpendicular to a transfer plane of a substratetransferred through the opening, and at least one drive located on theframe to a side of at least one of the sides that are substantiallyperpendicular to the door sealing surface and substantiallyperpendicular to the transfer plane of the substrate transferred throughthe opening, the at least one drive having actuators located at leastpartially in front of the sealing surface and the drive actuators beingcoupled to at least one of the sides of the door for moving the door toand from a sealed position. The at least one drive is located outside ofa substrate transfer zone for transferring substrates into and out ofthe at least one chamber through the opening.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and other features of the exemplary embodiment areexplained in the following description, taken in connection with theaccompanying drawings, wherein:

FIGS. 1A-1B are schematic perspective views of a substrate processingchamber module, incorporating features in accordance with an exemplaryembodiment shown from different perspective directions;

FIGS. 1C-1E are other schematic perspective views of the module fromother directions;

FIG. 1F is an exploded view of the module;

FIGS. 2 and 3 illustrates schematic views of substrate processing toolsincorporating aspects of the exemplary embodiments;

FIGS. 4A-4B are respectively a cross-sectional view and enlarged partialcross sectional view of the module;

FIGS. 5A-5B are other cross sectional views of the module and asubstrate transport apparatus in accordance with another exemplaryembodiment;

FIG. 6 is an elevation view of the module connected to another sectionof a processing tool in accordance with another exemplary embodiment;

FIGS. 7A-7B, respectively are another partial perspective view andcross-sectional view of the chamber module in accordance with anotherexemplary embodiment;

FIGS. 8A-8D are different schematic perspective views of valve modulesin accordance with other exemplary embodiments;

FIG. 9 is a schematic cross-sectional view of a portion of the module inaccordance with another exemplary embodiment.

FIG. 10A is an exploded perspective view of a chamber module inaccordance with another exemplary embodiment, and FIG. 10B is across-sectional view of the module;

FIGS. 11A-11B respectively are other cross-sectional views of the modulein different position, FIG. 11C is a partial cross-section view of aportion of the modules and substrates, FIGS. 11D-11E are perspectivecross-sections of the module in different positions;

FIGS. 12A-12B are other cross-section views of the module in accordancewith still another exemplary embodiments;

FIG. 13 is a partial cross-section view of the module in accordance withstill another exemplary embodiments;

FIGS. 14A, 14B illustrate load lock in two configurations in accordancewith an exemplary embodiment;

FIG. 14C illustrates a top view of a load lock in accordance with anexemplary embodiment;

FIGS. 14D and 14E illustrate front views of a load lock in twoconfigurations in accordance with an exemplary embodiment;

FIG. 15 shows a load lock incorporating features of the exemplaryembodiments;

FIGS. 15A, 15B illustrate portions of a door drive system in accordancewith exemplary embodiments;

FIG. 16 illustrates a sectional view of a processing systemincorporating features of exemplary embodiments;

FIG. 16A illustrates a top view of the load lock of FIG. 16 inaccordance with an exemplary embodiment;

FIGS. 16B and 16C illustrate front views of the load lock of FIG. 16 intwo configurations in accordance with an exemplary embodiment;

FIG. 17 shows an isometric view of a load lock incorporating features ofan exemplary embodiment;

FIG. 18 shows an isometric view of a load lock/door interface inaccordance with an exemplary embodiment;

FIG. 19 illustrates a sectional view of a load lock/door interface inaccordance with an exemplary embodiment with the door in a firstposition.

FIG. 20 illustrates a sectional view of a load lock/door interface inaccordance with an exemplary embodiment with the door in a secondposition;

FIG. 21 shows another sectional view of the load lock/door interface ofFIG. 203;

FIG. 22 is a schematic perspective view of a portion of load lockmodule, incorporating features in accordance with an exemplaryembodiment;

FIGS. 23A-23C illustrate a load lock module in accordance with anexemplary embodiment;

FIG. 24 illustrates a graph showing aspects of an exemplary embodiment;

FIG. 25 illustrates a processing tool and associated flow chart inaccordance with an exemplary embodiment; and

FIG. 26 illustrates a graph regarding substrate throughput in accordancewith an exemplary embodiment.

DETAILED DESCRIPTION

Referring to FIGS. 1A-1B, there is respectively shown schematicperspective views of a substrate processing module 10 incorporatingfeatures in accordance with an exemplary embodiment. Although theembodiments disclosed herein will be described with reference to theembodiments shown in the drawings, it should be understood that theembodiments can be embodied in many alternate forms. In addition, anysuitable size, shape or type of elements or materials could be used.

As may be realized from FIGS. 1A-1B, the module 10 may have a generalconfiguration allowing the module to be mated to a desired number ofsections of a processing tool capable of performing one or more desiredprocesses (such as material deposition, etching, lithography, ionimplant, cleaning, polishing, etc) to substrates. The substrates may beof any suitable type such as 200 mm, 300 mm, 450 mm dia semiconductorwafers, reticles, pelicles or panels for flat panel displays. The modulein the exemplary embodiment shown in FIGS. 1A-1B, may be a load lockmodule, though in alternate embodiments the module may be of anysuitable type. The configuration of the module in the exemplaryembodiment illustrated is exemplary and in alternate embodiments theload lock module may have any other desired configuration.

In one embodiment, the load lock module(s) 10 may communicate betweendifferent sections of a processing tool as can be seen in FIGS. 2 and 3.Each of the different sections, for example, may have differentatmospheres (e.g. inert gas on one side and vacuum on the other, oratmospheric clean air on one side and vacuum/inert gas on the other). Ascan be seen in FIG. 2, a processing apparatus, such as for example asemiconductor tool station 690 is shown in accordance with an exemplaryembodiment. Although a semiconductor tool is shown in the drawings, theembodiments described herein can be applied to any tool station orapplication employing robotic manipulators. In this example the tool 690is shown as a cluster tool, however the exemplary embodiments may beapplied to any suitable tool station such as, for example, a linear toolstation such as that shown in FIG. 3 and described in U.S. patentapplication Ser. No. 11/442,511, entitled “Linearly DistributedSemiconductor Workpiece Processing Tool,” filed May 26, 2006, thedisclosure of which is incorporated by reference herein in its entirety.The tool station 690 generally includes an atmospheric front end 600, avacuum load lock 610 and a vacuum back end 620. In alternateembodiments, the tool station may have any suitable configuration. Thecomponents of each of the front end 600, load lock 610 and back end 620may be connected to a controller 691 which may be part of any suitablecontrol architecture such as, for example, a clustered architecturecontrol. The control system may be a closed loop controller having amaster controller, cluster controllers and autonomous remote controllerssuch as those disclosed in U.S. patent application Ser. No. 11/178,615,entitled “Scalable Motion Control System,” filed Jul. 11, 2005, thedisclosure of which is incorporated by reference herein in its entirety.In alternate embodiments, any suitable controller and/or control systemmay be utilized.

In the exemplary embodiments, the front end 600 generally includes loadport modules 605 and a mini-environment 660 such as for example anequipment front end module (EFEM). The load port modules 605 may be boxopener/loader to tool standard (BOLTS) interfaces that conform to SEMIstandards E15.1, E47.1, E62, E19.5 or E1.9 for 300 mm load ports, frontopening or bottom opening boxes/pods and cassettes. In alternateembodiments, the load port modules may be configured as 200 mm waferinterfaces or any other suitable substrate interfaces such as forexample larger or smaller wafers or flat panels for flat panel displays.Although two load port modules are shown in FIG. 2, in alternateembodiments any suitable number of load port modules may be incorporatedinto the front end 600. The load port modules 605 may be configured toreceive substrate carriers or cassettes 650 from an overhead transportsystem, automatic guided vehicles, person guided vehicles, rail guidedvehicles or from any other suitable transport method. The load portmodules 605 may interface with the mini-environment 660 through loadports 640. The load ports 640 may allow the passage of substratesbetween the substrate cassettes 650 and the mini-environment 660. Themini-environment 660 generally includes a transfer robot (not shown) fortransporting the substrates from the cassettes 650 to, for example, theload lock 610. In one embodiment the transfer robot may be a trackmounted robot such as that described in, for example, U.S. Pat. No.6,002,840, the disclosure of which is incorporated by reference hereinin its entirety. The mini-environment 660 may provide a controlled,clean zone for substrate transfer between multiple load port modules.

The vacuum load lock 610 may be substantially similar to module 10 ofFIGS. 1A-1F and may be located between and connected to themini-environment 660 and the back end 620. The substrate holdingchamber(s) of the load lock 610 generally includes atmospheric andvacuum slot valves in a manner substantially similar to valves 12, 13(see FIG. 4A) described below. As may be realized, while the slot valvesare shown in the drawings as being in-line or about 180 degrees fromeach other, in alternate embodiments the slot valves may be locatedabout 90 degrees apart so as to form a substrate transport path havingsubstantially about a 90 degree angle. In still other alternateembodiments the slot valves may have any suitable spatial relationshipwith each other. Each slot valve of the chamber(s) may be independentlyclosable by a suitable door(s) of the slot valve. The slot valves mayprovide the environmental isolation employed to evacuate the load lock610 after loading a substrate from the atmospheric front end 600 and tomaintain the vacuum in the transport chamber 625 when venting the lockwith an inert gas such as nitrogen. Referring to FIG. 2, in oneexemplary embodiment the load lock 610 may also include an aligner foraligning a fiducial of the substrate to a desired position forprocessing. In alternate embodiments, the vacuum load lock may belocated in any suitable location of the processing apparatus and haveany suitable configuration including any suitable substrate processingequipment.

The vacuum back end 620 generally includes transport chamber 625, one ormore processing station(s) 630 and a transfer robot (not shown). Thetransfer robot may be located within the transport chamber 625 totransport substrates between the load lock 610 and the variousprocessing stations 630. The processing stations 630 may operate on thesubstrates through various deposition, etching, or other types ofprocesses to form electrical circuitry or other desired structure on thesubstrates. Typical processes include but are not limited to thin filmprocesses that use a vacuum such as plasma etch or other etchingprocesses, chemical vapor deposition (CVD), plasma vapor deposition(PVD), implantation such as ion implantation, metrology, rapid thermalprocessing (RTP), dry strip atomic layer deposition (ALD),oxidation/diffusion, forming of nitrides, vacuum lithography, epitaxy(EPI), wire bonder and evaporation or other thin film processes that usevacuum pressures. The processing stations 630 are connected to thetransport chamber 625 to allow substrates to be passed from thetransport chamber 625 to the processing stations 630 and vice versa.

Referring now to FIG. 3, another exemplary substrate processing toolhaving different sections is shown 710. In this example, the processingtool is a linear processing tool where the tool interface section 712 ismounted to a transport chamber module 718 so that the interface section712 is facing generally towards (e.g. inwards) but is offset from thelongitudinal axis X of the transport chamber 718. The transport chambermodule 718 may be extended in any suitable direction by attaching othertransport chamber modules 718A, 718I, 718J to interfaces 750, 760, 770as described in U.S. patent application Ser. No. 11/442,511, previouslyincorporated herein by reference. The interfaces 750, 760, 770 may besubstantially similar to the load lock 10 described herein. Eachtransport chamber module 718, 719A, 718I, 718J includes a suitablesubstrate transport 780 for transporting substrates throughout theprocessing system 710 and into and out of, for example, processingmodules PM. As may be realized, each chamber module may be capable ofholding an isolated or controlled atmosphere (e.g. N2, clean air,vacuum). In alternate embodiments, the transport chamber modules 718,719A, 718I, 718J may include features of the load lock 10 as describedherein.

Referring back to FIGS. 1A and 1B, as noted above, the load lock module10 may communicate between different sections (not shown) of aprocessing tool each for example with different atmospheres (e.g. inertgas on one side and vacuum on the other, or atmospheric clean air on oneside and vacuum/inert gas on the other). The load lock modules 10 maydefine a number of substrate holding chambers 14A, 14B therein(collectively referred to as chambers 14), as will be described furtherbelow, for example each capable of being isolated and capable of havingthe chamber atmospheres cycles to match atmospheres in the tool sectionsadjoining the module. Although only two substrate holding chambers 14A,14B are shown in the figures, it should be understood that the load lockmodules 10 may have more or less than two substrate holding chambers. Inthe exemplary embodiment the load lock module chamber(s) 14 may becompact allowing for rapid cycling of the chamber atmosphere as will bedescribed in greater detail below. Referring now also to FIGS. 1C-1E,the substrate holding chamber(s) 14 may have substrate transportopening(s) 16, 18 on the sides of the module. The location of thetransport openings 16, 18 shown in the figures is merely exemplary, andin alternate embodiments the chamber may communicate with openings inany other desired sides of the modules (such as the adjacent sides).Each transport opening of the chamber(s) may be independently closableby a suitable door(s) slot valves 12, 13.

Referring now also to FIGS. 4A-4B, respectively showing cross-sectionalview of the module 10, in the exemplary embodiment the internal modulemay define two or more independently isolable and cyclable substrateholding chambers 14A, 14B. In the exemplary embodiment, the chambers aredisposed in a stacked arrangement. Both chambers may be compactchambers, as will be described below. In alternate embodiments, theintegral module may have more or fewer chambers. In the exemplaryembodiments, the chambers may each have independently closable transportopenings, such as by suitable valves 12, 13 (for example atmospheric andvacuum slot valves), in common sides of the module. Accordingly, thetransport direction of substrates through each chamber are alongsubstantially parallel axes. In alternate embodiments, the chambers mayhave corresponding transport openings on different sides of the modules.In the exemplary embodiment, the valves (which for example may beconfigured as removably connectable (e.g. bolt on) modules, may belocated exterior to the chamber portions defined by the module.

Still referring to FIGS. 4A-4B, as described above, in the exemplaryembodiment the interior of the module 10 may define two or moreindependently isolatable and/or cyclable substrate holding chambers 14A,14B disposed in a stacked arrangement. In alternate embodiments thechambers may be disposed side by side or in any other suitable spatialrelationship relative to each other. Both chambers 14A, 14B may becompact chambers, as noted above. In alternate embodiments, the integralmodule may have more or fewer chambers. In the exemplary embodiments,the chambers may each have independently closable transport openings14AO, 14BO (see FIG. 1B), such as by suitable valves 12, 13 (for exampleatmospheric and vacuum slot valves), in respective sides of the module.Accordingly, the transport directions of substrates through each chamberare along substantially parallel axes. In one exemplary embodiment, thechambers 14A, 14B may be configured so that the transport direction ofsubstrates through each of the chambers 14A, 14B is bi-directional. Inother exemplary embodiments, the chambers may be configured so that atransport direction of substrates through one of the chambers 14A, 14Bis different than a transport direction of substrates through the otherone of the chambers 14A, 14B. As a non-limiting example, chamber 14A mayallow for the transfer of substrates from a front end unit to aprocessing chamber of a back end of a processing tool while chamber 14Ballows for the transfer of substrates from the processing chamber to thefront end unit. In alternate embodiments, the chambers may havecorresponding transport openings on different sides of the modules asdescribed above with respect to FIGS. 2 and 3. Each of the chambers 14A,14B and their respective slot valves 12, 13 may be independentlyoperable so that, for example, as substrates are cooled in one chamber14A, 14B, substrates can be placed in or removed from the other chamber14A, 14B.

In the exemplary embodiment the valves 12, 13, which for example, may beconfigured as removably connectable (e.g. bolt on or other suitablereleasable connection) modules, may be located exterior to the chamberportions 14A, 14B defined by the module 10. In alternate embodiments,the valve modules may be removably integrated within a wall of themodule 10 as will be described below in greater detail. In otheralternate embodiments the valves or a portion of the valves may not beremovable from the module 10.

Referring also to FIG. 1F, there is shown an exploded view of the module10 (upper and bottom closures 20, 22 are not shown for clarity). In theexemplary embodiment, the module may comprise a general core or skeletalframe section 30, and top and bottom cover section 32, 34. In theexemplary embodiment, the frame section 30 may be a one piece member(e.g. of unitary construction) made of any suitable material such asaluminum alloy. In alternate embodiments, the frame section may be anassembly, and may be made of any suitable materials or number ofsections. As seen in FIG. 1F, in the exemplary embodiments the framesection 30 may generally define the module exterior surfaces as well asthe bounds of the chambers defined therein. A web member W, as seen inFIGS. 1F and 4A, may section the module 10 to form the chamber stack. Inalternate embodiments the chamber may have more than one web member W.In other alternate embodiments the chamber stack may be formed in anysuitable manner. For example, the module 10 may have a general openinginto which a chamber sub-module may be fit where the chamber sub-moduleincludes a chamber stack having any suitable number of chambers. As maybe realized, the chambers 14A, 14B may be respectively closed at the topand bottom by closures 32, 34 which may be mated to the frame 30 usingany desirable connection including, but not limited to, mechanical,electrical and/or chemical fasteners. Interfaces for the slot valves 12,13 may be mated to the frame 30 in any suitable manner, such as thatshown in the figures and described below in greater detail. As may berealized, the load lock module 10 is a communication module serving forthrough transfer of substrates between tool sections linked by the loadlock module 10. Accordingly, the height of the module 10 may be relatedto the height of adjoining sections or modules, and may be dependent onsuch factors as the z axis travel of substrate transport apparatus inthe adjoining module (responsible for through put via the load lockmodule and which in turn may be delimited by such factors as size orz-drive and/or structural consideration of the module). An example ofthe relationship between through module 10 and rotating module 15illustrated in FIG. 6 which shows load lock module 10 mated to asubstrate transport chamber 7 of a cluster tool. As may be realized,providing module 10 with a larger height than the available z-travel ofthe transport apparatus, may result in an unstable load lock volumeincreasing pump down/vent times. Similarly, providing a module heightsmaller than the available z-travel fails to use the whole travelbandwidth available from the transport apparatus, and thus undulyrestricted through put of the load lock module. In the exemplaryembodiment, the features of the load lock chamber(s) 14A, 14B, result ina configuration with a height that enables a stack of load lock chambersto be defined within the module 10. As noted before, and shown in FIGS.4A-4B, in the exemplary embodiments two load lock chambers 14A, 14B areformed in stacked arrangement in the module 10, though in alternateembodiments the load lock chamber stack in the unitary module mayinclude more (or less) load lock chambers, such as three or more. As maybe realized, providing multiple independent load lock chambers 14A, 14B,within the compact space envelope of the common module 10, generatesmultiple independent and unconstrained transport paths through thecommon module 10, with a commensurate increase in through put of themodule 10. In the exemplary embodiment illustrated in FIGS. 1A-1E, eachload lock chamber 14A, 14B may be generally similar to each other. Inone exemplary embodiment the load lock chambers 14A, 14B may haveopposite hand configurations along the mid-plane separating the loadlocks. In alternate embodiments, the load locks may be different, suchas to handle different sizes and or types of substrates. The module 10,as shown in FIG. 1F, may have a modular arrangement, enabling the loadlock to be built out in similar or different configurations byinstalling desired modules. In the exemplary embodiment, the load lockchambers 14A, 14B may have a height sufficient to hold a number ofstacked substrates (in FIGS. 4A-4B two substrates are shown, forexample, in each chamber). In alternate embodiments, the load lockchambers 14A, 14B may be capable of holding more or fewer stackedsubstrates as desired.

Referring again to FIGS. 4A-4B, in the exemplary embodiment each of theload lock chambers 14A, 14B may have a heating or cooling device, orboth, to heat or cool the substrates held in the load lock as the loadlock atmosphere is cycled. A suitable example of a load lock havingcooling/heating features will be described below. As seen in FIG. 4A, inthe exemplary embodiment, each load lock may have support shelves 22A,22B for thermally operating on the substrates via conduction forexample. In the exemplary embodiment, the support shelves 22A, 22B maybe configured for cooling the substrates, such as for example duringload lock venting. For example, the support shelves may be connected toa suitable thermal sink such as for example, cooling block 27 in anydesired manner to define a substrate cooling surface 24A, 24B, forexample on the upper surface of each support shelf 22A, 22B. In oneexample, the cooling block 27 may include radiative fins (not shown) forproviding heat transfer from the substrate cooling surface 24A, 24Bwhile in other examples, the cooling block may have a cooling fluidflowing therein for drawing heat from the substrate cooling surface 24A,24B. In still other examples, the cooling block 27 may have acombination of radiative fins and cooling fluid flow. In alternateembodiments the support shelves may have a substrate heating surface. Instill other alternate embodiments the load lock may be configured toheat the gas or gases within the load lock as described herein.

In the exemplary embodiment, each load lock has two support shelves 22A,22B with cooling surfaces 24A, 24B (though as noted before more or fewerwafer cooling surfaces may be provided). As may be realized, thermalexchange via conduction between substrates and cooling surfaces ofsupport shelves 22A, 22B may be effected by seating the substrate(s) onthe cooling surface(s) 24A, 24B of the support shelves 22A, 22B. In theexemplary embodiment, the support shelves may be a solid state device(e.g. without actuable/moving mechanical components). As may berealized, this provides the support shelves 22A, 22B with a minimizedprofile and pitch (and hence contributing to the compact height of theload lock chamber). By way of example, the support shelves 22A, 22B maybe fixed or stationary relative to the frame section 30 and have a pitchof about 10 mm, sufficient to allow substrates to be picked from andplaced directly in a seated position onto the cooling surface 24A, 24Bwith the end effector EE of a transport apparatus transferringsubstrates to and from the load lock chambers 14A, 14B (see also FIGS.5A-5B and 6). In alternate embodiments the shelves may have any suitablepitch. In other exemplary embodiments the support shelves 22A, 22B maybe movable relative to the frame section 30 so that the pitch of theshelves can be adjusted depending on a predetermined distance betweenthe shelves 22A, 22B. As seen best in FIG. 4B, the support shelves 22A,22B may be arranged to form a pass-through gap 26 for the end effectorEE. In the exemplary embodiment, the support shelves 22A, 22B may besectioned forming gap 26 in between sufficient to accommodate the endeffector blade. As may be realized, the gap 26 allows end effector zmotion to pick and place substrates on the cooling surface. By way ofexample, the end effector EE may be capable of substantiallysimultaneously placing substrates on the cooling surfaces 24A, 24B ofthe support shelves 22A, 22B (in one of the stacked load locks). Forexample the substrates may be simultaneously cooled, as the load lockchamber is being vented. The cooled substrates may be substantiallysimultaneously picked and transported from the load lock 22A. As thesubstrates are cooled in one load lock chamber 14A, 14B, operations inthe other load lock chamber 14A, 14B (of the load lock module 10) may beperformed in a substantially unconstrained manner. In alternateembodiments, the operations performed in each of the load lock chambersmay be chronologically linked to each other in any suitable manner.

Referring again to FIGS. 1A-1B, in the exemplary embodiment each loadlock chamber 14A, 14B (see also FIGS. 4A, 4B) may have correspondingvacuum control valves 40A, 40B and vent valves 42A, 42B (such as with orwithout a diffuser) enabling independent cycling of the respective loadlock atmospheres. In the exemplary embodiment, the vacuum control valves40A, 40B and vent valves 42A, 42B may be arranged in modules that may beinterchangeable with each other as will be described below. Referringnow again to FIG. 1F, in the exemplary embodiment section 30 may haveports 36A, 36B, 37A, 37B, formed therein. The ports may definerespective vacuum ports 36A, 36B, and vent ports 37A, 37B in each of theload lock chambers 14A, 14B. The arrangement of the vent and vacuumports shown in the figures is exemplary, and in alternate embodimentsthe vent and vacuum ports may have any other suitable arrangement. Inthe exemplary embodiment, vacuum ports 36A, 36B may be located on oneside of the module 10, and the vent ports 37A, 37B may be located in adifferent side of the module 10. In alternate embodiments the vent andvacuum ports may be located on the same side of the module. As seen inFIG. 1F the vacuum and vent ports 36A, 37A, 36B, 37B for the respectiveload locks 14A, 14B may be vertically offset from each other. Inalternate embodiments the vacuum and vent ports may be vertically inline with each other or have any other suitable spatial relationshipwith each other. Each of the ports may have a suitable mating interface(e.g. surrounding the port) to facilitate connection of the desiredvacuum or vent valve to the port (and hence the module). In theexemplary embodiment, two or more of the mating interfaces 38A, 38B,39A, 39B, for the respective ports may be configured to have asubstantially similar mating arrangement (e.g. mapping flanges, sealingsurfaces, bolting pattern) allowing any valve with a complementingmating interface to mate with the mating interface of either port. Byway of example, as seen best in FIGS. 1B and 1F, the vent valves may beintegrated into vent valve modules 42A, 42B, each having a similarmating interface 421 allowing either module to be interchangeablymounted to the vent port interface of either chamber. In the exemplaryembodiment, the vent valve modules 42A, 42B, which may have a pressurecasing or boot of unitary construction, may include vent valve bodies42VB providing different flow rates or control configurations (e.g. athrottling valve and/or different capacity case valves). It is notedthat while the exemplary embodiments may be described with respect toseparate vent and vacuum ports, in other exemplary embodiments, thevalves may be configured to vent and pump out the chamber through asingle port. For example, the valves may be configured with suitablevalving characteristics to switch between a vacuum source and a ventingsource. In other alternate embodiments each module may have a vent andvacuum port so that the chamber(s) can be vented and/or pumped down witha single vent/vacuum module.

In the example shown, the vent valve module casing 42A, 42B allowsinstallation of, for example, three valve bodies 42VB that may have acommon source and common exhaust. The valve module 42A, 42B, as may berealized, may be configurable to provide any desired number of valvebodies 42VB to achieve any desired predetermined valving profile. Inalternate embodiments, the module body 42A, 42B may be capable ofaccommodating more or fewer valves therein. Different exemplaryembodiments of the vent modules 42A, 42B, 42A′ are shown in FIGS. 1A-1F,and 8A-8D. As may be realized, the embodiments of the vent modules shownin the Figures are for illustrative purposes only and the vent modulesmay have any suitable module body 42AB configuration for connecting thevent modules to, for example, the gas inlet, valve bodies 42VB, anddiffuser 44A. The different modules however, with different modulebodies 42AB and valves 42VB included therein, may share a common matinginterface arrangement 42I and hence allow interchangeability of the ventmodules 42A, 42B, 42A′ at the load lock chamber 10. In the exemplaryembodiment, the vent valve module 42A, 42B may also include a suitablediffuser 44A, which for example may be positioned so that, upon mountingof the valve module 42A, 42B to the vent port 37A, 37B of the load lockchamber, the diffuser 44A may be located substantially at or near theexhaust plane of the vent port into the load lock chamber. In oneembodiment the vent valve module 42A, 42B may be configured to acceptand/or secure the diffuser 44A in a recess (or other suitable cavity orslot in the module body 42AB). In alternate embodiments, the diffusermay be incorporated or fit into, for example, a wall of the load lock 10at for example, vent ports 36A, 37A, 36B, 37B.

Referring now to FIGS. 7A-7B, there is respectively shown a perspectiveview and cross-sectional view of the module 10′ in accordance withanother exemplary embodiment. Module 10′ may be substantially similar tomodule 10 described previously. In the exemplary embodiment shown, thevacuum control valves and vent valve(s) may be integrated into a singlemodule 40A′, 40B′. As seen best in FIG. 7B, the module structure mayhave ports 36A′, 36B′, 37A′, 37B′ formed therein. In the exemplaryembodiment shown, the ports may be disposed in a generally symmetricalarrangement, (for example ports may be formed in both side walls asshown, allowing vacuum and vent plumbing attachments to either side ofthe module). Accordingly, each load lock chamber may have for example,four available ports for connection of vacuum and vent plumbing, such astwo ports on either side. In alternate embodiments, each load lockchamber may have any suitable number of ports having any suitablespatial relationship with each other. In the exemplary embodiment, themating interface 38A′, 38B′, 39A′, 39B′ for the ports 36A′, 36B′, 37A′,37B′ may be similar to allow, for example, the interchangeability of themodules 40A′, 40B′. In alternate embodiments, one or more of the matinginterfaces may be dissimilar to allow for selective interchangeabilitybetween the interfaces and respective modules having correspondinginterfaces. As seen in FIG. 7B, the mating interfaces 38A′, 38B′, 39A′,39B′ may be arranged in port pairs disposed one above the other (e.g.port). For example, ports 36A′ and 36B′ may be located in the samemodule wall, one above the other and may share a mating interface 39A′.In this exemplary embodiment each valve module 40A′, 40B′, may beinterchangeably mated to any port pair mating interface 38A′, 38B′,39A′, 39B′. The valve module 40A′, 40B′, may be configured tocommunicate with each port (e.g. 36A′, 36B′) of a port pair when matedto the chamber module 10′ (as shown in FIGS. 7A-7B). In the exemplaryembodiment, the valve module 40A′, 40B′ may have a module body 41B′ thatmay form a mating interfacing configured to mate with the module 10′,where the mating interface of the module body 41B′ includes respectivevent (exhaust) and vacuum (inlet) ports. A vacuum control valve 40V maybe mounted to the module body 41B′ in fluid communication with thevacuum port. Similarly a vent valve(s) 42VB′ may be included in themodule body 41B′ in fluid communication with the vent port. In theexemplary embodiment, the valve module arrangement results in one module40A′, 40B′ operating to vent a given load lock chamber 14A′, 14B′ andthe other module 40A′, 40B′ operating to pump down the load lock chamber14A′, 14B′. The valve modules 40A′, 40B′ may include a vent diffuser,for example located in a manner as previously described. As can be seenin FIGS. 7A and 7B, the modules 40A′ and 40B′ are configured so thateach module communicates with both the chambers 14A′, 14B′. For example,module 40B′ may be coupled to the module 10′ such that module 40B′ ventschamber 14A′ and pumps (e.g. evacuates via vacuum) chamber 14B′. Module40A′ is coupled to the module 10′ so that module 40A′ vents chamber 14B′and pumps chamber 14A′. As may be realized, where the load lock moduleincludes a single load lock chamber, the single load lock chamber mayhave a pump/vent interface having vent and vacuum port pairssubstantially similar to those described above. The port pairs may beconfigured to interface with a pump/vent module substantially similar tomodules 40A′, 40B′ so that the single chamber can be vented and pumpedwith a single module to reduce or minimize, for example, the complexity,size and cost of the single load lock module.

Referring now to FIG. 9, there is shown a cross sectional view of thesubstrate support shelves 22A, 22B of the load lock module in accordancewith another exemplary embodiment. Although there are four supportshelves shown in FIG. 9 (e.g. two shelves in each chamber as describedabove), only two shelves 22A, 22B will be described for examplepurposes. It is noted that the remaining substrate support shelves maybe substantially similar to shelves 22A, 22B. The support shelves 22A,22B in the exemplary embodiment shown in FIG. 9, may be generallysimilar to the support shelves previously described and shown in FIGS.5A and 5B. The support shelves 22A, 22B may be static and may bearranged at a desired pitch P (e.g. 10 mm or any other suitable distancemore or less than 10 mm) to support substrates S in a stack. In oneexemplary embodiment, the support shelves 22A, 22B may be adjustable andconfigured to allow adjustment of the pitch P. In still other exemplaryembodiments the shelves 22A, 22B may be movable relative to each otheras will be described in greater detail below. In alternate embodimentsthe support shelves 22A, 22B may be modular so that additional shelvescan be added (or removed) depending on, for example, a desired pitch P.In the exemplary embodiment, each support shelf 22A, 22B may have acooling surface 24A, 24B for conduction cooling substrate(s) S1, S2seated against a respective one of the shelf cooling surfaces 24A, 24B.In the exemplary embodiments, shown in FIG. 9, each substrate support22A, 22B (the number of support shelves shown is exemplary and inalternate embodiments there may be more or fewer support shelves) mayhave gas ports 54. The gas ports 54 are illustrated schematically inFIG. 9, and may comprise any number of ports, distributed along thesupport shelves, of any desired size. The gas ports 54 may be configuredso that the gas passing through the ports has a laminar flow to, forexample, minimize particle formation. In one exemplary embodiment theports 54 may include any suitable diffusers while in other exemplaryembodiments diffusers may be located up stream of the ports 54. Inalternate embodiments the diffuser(s) may have any suitable spatialrelation with a respective port(s). As seen in FIG. 9, the gas ports 54are positioned between the respective lower and upper surfaces ofcorresponding upper and lower substrates S1, S2 seated on the coolingsurfaces 24A, 24B of the support shelves 22A, 22B. The ports 54, may beconnected via suitable passages, that may be integrally formed withinthe support shelves 22A, 22B for example, to a suitable supply of gassuitable for the vent atmosphere in the load lock chamber (e.g. ventgas). In alternate embodiments the passages may not be integrally formedwithin the support shelves. As seen in FIG. 9, the gas port(s) 54 areconfigured to exhaust gas into the gap 6 between exposed substratesurfaces (e.g. adjacent cooling substrates S1, S2 (see also e.g. FIGS. 7and 9)). For example, one or more of the support shelves 22A, 22B mayhave a gap or aperture 6 (such as to allow end effector access similarto gap 26 as shown in FIG. 5B) that may expose an upper substrate (at araised temperature) on, for example, shelf 22A which is being cooled toanother lower substrate on, for example, shelf 22B also having a raisedtemperature and being cooled. The gas exhausted from the ports 54, ingap 6, may form a thermal break or barrier TB (the size and location ofwhich is shown in the Figures for exemplary purposes only) between theheated lower substrate S1 and uncovered surface of the upper substrateS2 to minimize or eliminate any convectional heating of the uppersubstrate S2 by the lower substrate S1. The circulating gas may alsoprovide convectional cooling with respect to the substrates in additionto the conduction cooling. As may be realized, and by way of example,gas exhausted from ports 54A, 54 may flow within gap 6, disruptingstagnant gas within gap 6 and hence disrupting undesired heat transfervia convection between the hot lower substrate S1 to the exposed surfaceof the hot upper substrate S2. As may also be realized, the gasintroduced by ports 54A, 54 may be removed or caused to flow (creatinggas circulation) by, for example, suitable vacuum or gas removal portssuitably located within the chamber (e.g. in the gap 6 or other suitablelocation). In one example, the vacuum ports may be incorporated into thesupport shelves 22A, 22B in a manner substantially similar to thatdescribed above with respect to ports 54. In other examples, the vacuumports may be located in the chamber walls between the support shelves asshown in FIG. 9 with respect to vacuum port 55. Hence, this results inlowered cooling times for the substrate stack, as cooling distributionof the stacked substrates may be maintained substantially constantacross the substrate stack. As may be realized the gas exhausted fromports 54, 54A may have defined Reynolds (Re) number for low speedlaminar flow and to avoid particulate deposition on the upper surface oflower substrates as described above.

Referring now to FIGS. 10A and 10B there is shown an explodedperspective view of a load lock module 100 in accordance with anotherexemplary embodiment. Module 100 may be substantially similar to loadlock module 10 described before. In the exemplary embodiment, module 100may also have two load lock chambers 114A, 114B stacked over each other,but in alternate embodiments the load lock module may have any suitablenumber of stacked chambers. Module 100 may also include cooling chucks120A, 120B. Each load lock chamber 114A, 114B has a cooling chucklocated therein. The cooling chucks 120A, 120B are capable of z axismotion, driven by suitable z-drives 120Z. In alternate embodiments, thechuck may also be capable of horizontal (e.g. X and Y) movement. Thechucks 120A, 120B are generally arranged in a generally opposingconfiguration as shown so that the chucks move toward or away from eachother when actuated in, for example, the direction of arrow 700.Referring to FIG. 10B, which shows a cross-section of the module 100with the load locks in what may be referred to as a ready position, eachload lock chamber 114A, 114B may have support shelves 122A, 122B tosupport two substrates S1, S2 in each load lock chamber 114A, 114B (moreor fewer substrates may be provided in alternate embodiments)(see alsoFIG. 11C). In the exemplary embodiment, support shelves 122A may bestatic, (e.g. fixed to the chamber structure or any other suitably fixedstructure within the chamber) and support shelves 122B may be movable(e.g. dependent from the movable chuck 120A, 120B or any other suitablemovable shelf support). In alternate embodiments, both of the supportshelves may be static, while in other alternate embodiments both supportshelves may be movable. In one exemplary embodiment, the shelves 122Bmay be supported by and connected to the chuck 120A, 120B by extensionsor shelf supports 121A, 121B. The extensions 121A, 121B may be ofunitary construction with a respective one of the chucks 120A, 120Band/or the shelves 122B. In alternate embodiments the shelf supports121A, 121B may have any suitable configuration. As can be seen in FIG.10B the extensions 121A, 121B extend away from the surface 124A of thechuck 120A, 120B so that the fixed shelves 122A are located between thesurface 124A and shelves 122B (which depend from the extensions 121A,121B). As may be realized when the chuck 120A, 120B is in the retractedposition there is sufficient clearance between the shelves 122A, 122B toallow placement of a substrate on the shelves 122B by, for example, anend effector of a substrate transport.

The support shelves may be arranged in the exemplary embodiment so thatsubstrates may be picked or loaded substantially onto the respectivesupport shelves 122A, 122B by, for example, z-motion of the transfer armend effector. In alternate embodiments, the support shelves and orchambers may be moveable to lift substrates off of the end effector. Thechuck 120A, 120B may be located in a battery, opened, retractedposition, as shown in FIG. 10B (see also FIG. 11D), for loading andunloading substrates from/to the load lock chamber 114A, 114B. In theexemplary embodiment, the position of the chuck 120A, 120B may bealtered (in the z axis (i.e. the direction of arrow 700), for example,to what may be referred to as a closed position, see also FIG. 11E) toeffect substantially simultaneous cooling of the substrates on thesupport shelves 122A, 122B of the load lock chambers 114A, 114B. Inalternate embodiments, the chuck may be capable of effecting heating ofthe substrates, or both cooling and heating. In the exemplary embodimentshown in FIG. 10B, the chuck 120A, 120B may have a thermal transfercontact surface 124A (e.g. a conductive cooling surface). The thermaltransfer surface 124A on the chuck 120A, 120B, may be communicativelyconnected thermally to a suitable thermal sink 152A. In the exemplaryembodiment shown in FIG. 10B, this thermal communication isschematically illustrated as interfacing radiator fins 150A, 152Arespectively on chuck and chamber that are configured to allow freedomof movement of the chuck in the z-direction. In alternate embodimentsthe thermal sink may have any suitable configuration. As seen in FIG.7B, each chamber 114A, 114B may have a static thermal transfer contactsurface 124B, (e.g. cooling surface) that may be located generallyopposite the chuck 120A, 102B. Referring also to FIG. 11A, the module100 is shown with the cooling chuck 120A, 102B in the opened position,and substrates S1, S2 loaded on respective support shelves of the loadlock chamber 114A, 114B. As noted before, to cool the substrates, thechuck 120A may be moved (in z direction) to the closed position. Forexample as shown in FIG. 11B (see also FIGS. 11D-11E, which areperspective cross-sections respectively showing the chuck in opened andclosed positions). It is noted that the operation of chuck 120B may besubstantially similar to that of chuck 120A. Each of the chucks 120A,120B may be independently operable, and chucks 120A, 120B are shownclosed in FIG. 11B merely for exemplary purposes. In alternateembodiments, the chuck 120A, 120B in one load lock chamber 114A, 114Bmay be opened and the other chuck 120A, 120B in the other load lockchamber 114A, 114B may be closed or in any other desired positionbetween opened and closed. As seen in FIG. 11B, motion to the closedposition moves the chuck borne substrate S1, S2 (e.g. the substrate onshelves 122B) toward and into substantial contact with stack coolingsurface 124B, and moves the chuck cooling surface 124A into substantialcontact with a respective substrate S1, S2 on static shelves 122A. Thus,differential motion between chuck 120A, 120B and load lock chamber 114A,114B effects substantial simultaneous cooling of multiple substrates.The chuck 120A, 120B may be returned to the opened position to unloadthe substrates S1, S2. In alternate embodiments, the chuck may beconfigured to allow removal (and insertion) of the substrates S1, S2without returning to the open position.

FIGS. 12A-12B are cross-sections of the module showing a cooling chuckheat exchanger arrangement 1000 in accordance with another exemplaryembodiment, in which suitable conduits 1001 direct heat exchanging fluidinto the head of the chuck 120A, 120B to maintain the thermal transferplate at a desired temperature. The fluid conduit 1001 may be flexibleto allow, for example, 3-axis motion of the chuck as previouslydescribed. In alternate embodiments, the interface between the fluidconduit 1001, which may be rigid or semi-rigid, and the chuck 120A, 120Bmay be a sliding or telescoping interface/coupling having suitablesealing members for sealing the interface while allowing relativemovement between the conduit 1001 and the chuck 120A, 120B.

As can also be seen in FIGS. 12A and 12B, the heat exchanger arrangementmay also include conduits 1002 for directing heat exchanging fluid intothe static thermal transfer surface 124B. The cooling fluid may be anysuitable fluid including but not limited to, water, oil, air or anyother suitable fluid capable of transferring heat from the chuck 120A,120B and static thermal transfer surface 120B. The cooling chuck heatexchanger arrangement may include any suitable fluid temperatureregulating device (not shown) such as, for example, a radiator havingsuitable feed and return lines for cooling the fluid during circulationinto and out of the chuck 120A, 120B and/or static thermal transfersurface 120B. It is also noted that only the cooling fluid feed linesare (e.g. the lines transporting the cooling into the chuck and staticthermal transfer surface) are shown for exemplary purposes only. Inalternate embodiments, the chuck 120A, 102B and the static thermaltransfer surface 124B may be fed by separate cooling lines and/orseparate heat exchanger systems.

Referring now to FIG. 13, there is shown a partial cross-section view ofa load lock chamber 114A′, of module 100′ in accordance with anotherexemplary embodiment. Module 100′ may be similar to module 100, and mayinclude a movable chuck 120A′. Chuck 120A′ may have substrate supportshelves dependent therefrom in a manner substantially similar to thatdescribed above. The load lock chamber 114A′ may have substrate supportshelves 122A′ dependent therefrom. The chuck 120A′ may have a thermaltransfer surface 124A′. The load lock chamber 114A′ may have a thermaltransfer surface 124B′ disposed thereon. The thermal transfer surface124B′ may be communicably connected, via suitable heat exchanger means,to heat sources +q. In the exemplary embodiment, during pump down of theload lock, the chuck may be actuated to decrease a gap between, forexample, the substrate on the load lock support shelves 122A′ and thechuck surface 124A′, or between the substrate on the chuck supportshelves 122B′ and load lock surface 124B′. The decreased gap betweensubstrate and adjoining surface operates to increase gas temperature tomitigate particulate creation at pump down.

Further, thermal surfaces 124A′, 124B′, may be heated to direct heatinto the gas, such as in combination with chuck motion, or alone, tofurther mitigate particular formation at load lock pump down.

Referring now to FIGS. 14A-14E, an exemplary load lock 10100 is shown inaccordance with an exemplary embodiment. Although the exemplaryembodiments will be described with respect to atmospheric doors or slotvalves, it should be realized that the disclosed embodiments can beequally applied to vacuum doors or slot valves used in the substrateprocessing equipment.

In this example the load lock 10100 is configured as a stacked load lockhaving a first load lock chamber 10140 and a second load lock chamber10150. In alternate embodiments the load lock may have any suitableconfiguration. Each of the load lock chambers 10140, 10150 may have anysuitable configuration including, but not limited to, those describedabove. For example, the load lock chambers 10140, 10150 may beconfigured as dual load lock chambers (i.e. each load lock is configuredto hold two substrates) or single load lock chambers (i.e. each loadlock is configured to hold one substrate). In alternate embodiments eachof the load lock chambers 10140, 10150 may be configured to hold morethan two substrates. Each of the load lock chambers 10140, 10150 mayhave an atmospheric load lock door 10130, 10120 and a vacuum load lockdoor or slot valve 10160, 10161. In this example, atmospheric load lockdoor 10130 and vacuum slot valve 10160 are respectively the atmosphericand vacuum doors for load lock chamber 10140 and load lock door 10120and slot valve 10161 are respectively the atmospheric and vacuum doorsfor load lock chamber 10150. The atmospheric doors 10130, 10120 mayallow the load lock to be coupled to an atmospheric processing unitincluding, but not limited to an Equipment Front End Module (EFEM) whilethe slot valves 10160, 10161 allow the load lock to be coupled to avacuum module including, but not limited to processing modules asdescribed above with respect to FIGS. 2 and 3, for example.

The load lock 10100 is shown in FIGS. 14A and 14D with the atmosphericdoors 10130, 10120 in a closed position while FIGS. 14B and 14E show theatmospheric doors 10130, 10120 in an open position for allowing thepassage of substrates into or out of the respective load lock chambers10140, 10150. Referring also to FIG. 15, the load lock doors areoperated through one or more drive modules such as drive modules 10200,10210. The drive modules 10200, 10210 are shown in this example being oneither side of the doors 10130, 10120 for exemplary purposes. In otherexemplary embodiments there may be only one drive module located oneither side of the doors 10130, 10120 while a suitable bearing modulemay be located on the other side of the door for suitably supporting thedoors as will be described below. In still other alternate embodiments,there may be any suitable number of drive modules located in anysuitable position relative to the doors. It is noted that the drivemodules 10200, 10210 are located outside of the substrate transfer zone10110 as can be seen in FIGS. 14B and 14C. Positioning the drive modules10200, 10210 outside of the substrate transfer zone may allow for theremoval of protective bellows or particulate shields that are used toprotect the substrate from particles generated by moving partspositioned above the substrates.

The drive modules 10200, 10210 may be located at least partially infront of a sealing contact surface 10230 of the load lock chambers withrespect to a direction of substrate travel into the load lock chamberthrough an opening of the load lock chamber. In alternate embodimentsthe drive modules may be suitably configured for placement in front ofor behind the sealing contact surface 10230 in any suitable manner. Thesealing contact surface 10230 may be the surface of the load lock 10100that interacts with the atmospheric doors 10130, 10120 to form a seal toprevent leakage to or from an atmosphere within the load lock chambers10140, 10150. In one exemplary embodiment, the drive modules 10200,10210 may be modular units that are coupled to a surface of the loadlock 10100 by for example, mechanical fasteners, chemical fasteners,adhesives or welding. As may be realized the drive modules 10200, 10210may be permanently coupled or removably coupled to the surface of theload lock 10100. In other exemplary embodiments the drive units may beintegral to the load lock 10100 such that the drive modules form part ofthe load lock housing. In the exemplary embodiment shown in the figures,the drive modules 10200, 10210 are shown as being partially embedded inthe load lock housing. The drive modules 10200, 10210 may includesuitable access panels or covers for allowing access to the drives10210A, 10210B, 10200A, 10200B located within the drive modules as willbe described below. In alternate embodiments, access to the drives10210A, 10210B, 10200A, 10200B may be provided in any suitable manner.

The drive modules 10200, 10210 may each include upper drive actuators10200A, 10210A and lower drive actuators 10200B, 10210B respectively.The drive actuators 10210A, 10210B, 10200A, 10200B may be any suitabledrives including, but not limited to, hydraulic drives, pneumaticdrives, pressure differential drives, electrical rotary or linear drivesand magnetic drives. The drive actuators may be configured as 10210A,10210B, 10200A, 10200B one axis or two axis drives. In alternateembodiments the drives may have more than two axes. The drives may beconfigured to move the doors 10130, 10120 away from the contact surface10230 as the doors are opened to minimize particle generation andsubstrate contamination. The drives may also be configured to move thedoors 10130, 10120 into contact with the sealing contact surface 10230in a manner such that particle generation is minimized.

The upper drive actuators 10200A, 10210A may work in conjunction witheach other to open and close door 10130 while lower drive actuators10200B, 10210B may work in conjunction with each other to open and closedoor 10120. In this example, the doors 10130, 10120 are individuallyoperable in that, for example, one door may open and close while theother remains closed or one door may open while the other is closed. Inalternate embodiments, there may be one drive in each drive module10200, 10210 that is coupled to a respective door such that both doorsopen at the same time and both doors close at the same time. In stillother alternate embodiments the single drive within each of the drivemodules 10200, 10210 may be differentially coupled to a respective doorsuch that as one door opens the other door is closed. In still otheralternate embodiments only one of the drive modules 10200, 10210 mayinclude one or more drives while the other one of the drive module10200, 10210 may be passively driven by the first drive module. Forexample, drive module 10210 may suitably support and drive the doors10130, 10120 while drive module 10200 includes suitable linear bearingsfor supporting and allowing movement of the doors 10130, 10120.

Still referring to FIG. 15 each of the drive modules 10200, 10210 mayinclude openings located in front of the contact surface 10230 that areconfigured to allow each of the atmospheric doors 10130, 10120 to becoupled to their respective drives. For example, drive module 10200 mayinclude opening 10203 to allow door 10130 to be coupled to upper drive10200A and opening 10204 to allow door 10120 to be coupled to lowerdrive 10200B. In this example the opening is substantially orthogonal tothe door contact surface 10230 but in alternate embodiments the openingmay be substantially parallel to the contact surface 10230. In otheralternate embodiments the opening may have any suitable spatialrelationship with respect to the contact surface 10230. Drive module10210 may include opening 10201 to allow door 10130 to be coupled toupper drive 10210A and opening 10202 to allow door 10120 to be coupledto lower drive 10210B. In one exemplary embodiment, the openings10201-10204 may include any suitable seals including, but not limitedto, bellows seals such that any particulate generated by the drives arecontained and do not contaminate any substrates entering or exiting theload lock 10100. The doors 10130, 10120 may be coupled to theirrespective drives in any suitable manner. For example, door 10130 may becoupled to upper drive 10210A by link 10204A and to upper drive 10200Aby link 10204B. As can be seen in the Figures the links 10204A, 10204Brun substantially parallel with the contact surface 10230 but may besuitably spaced apart from the contact surface 10230 to, for example,avoid particle generation. In one exemplary embodiment, the links mayextend from a respective door 10130, 10120 and be of unitaryconstruction with the door. In other exemplary embodiments the door andtheir respective links may be an assembly where the links are coupled tothe doors in any suitable manner. The door 10120 may be coupled to lowerdrive 10210B by link 10203A and to lower drive 10200B by link 10203B. Itis noted that the links 10204A, 10204B, 10203A, 10203B are located infront of the contact surface 10230 such that sufficient clearance existsbetween the contact surface 10230 and the links to substantially preventor minimize particle generation and substrate contamination. Inalternate embodiments the links 10204A, 10204B, 10203A, 10203B may haveany suitable spatial relationship with the contact surface 10230 and beconfigured to minimize particle generation. The links 10204A, 10204B,10203A, 10203B may be coupled to their respective drives 10210A, 10210B,10200A, 10200B such that as the doors are opened and closed the doorsremain parallel to the contact surface 10230 of the load lock 10100. Inalternate embodiments the links 10204A, 10204B, 10203A, 10203B may becoupled to their respective drives to allow the doors to rotate withrespect to the contact surface 10230 as the doors are opened and closed.

It is noted that the openings 10201-10204 are shown in the Figures asbeing substantially straight such that the doors 10130, 10120 travel ina substantially straight line that is substantially parallel to thecontact surface 10230 of the load lock. In other exemplary embodimentsthe openings 10201-10204 may have any suitable shape as will bedescribed in greater detail below. Any suitable seal may be providedbetween the doors 10130, 10120 and the contact surface 10230 to preventleakage to or from an internal atmosphere of the load lock chambers10140, 10150. The seal in this exemplary embodiment may be configured tominimize friction and particulate generation as the doors are opened andclosed. In other exemplary embodiments, the openings 10201-10204 may beangled or configured as can be seen in FIGS. 15A, 15B such that as thedoors 10130, 10120 are opened, the doors 10130, 10120 are moved awayfrom the contact surface 10230 to prevent rubbing of the doors and/orseal against the contact surface 10230. In FIG. 15A the opening 10201′is shown as being angled away from the contact surface 10230 such thatas the door is moved in the direction of arrow T the opening 10201′guides the door away from the contact surface 10230 and vice versa. FIG.15B shows the opening 10201″ having a cam configuration that guides thedoor away from the contact surface 10230 as the door is moved in thedirection of arrow T and towards the contact surface 10230 as the dooris closed in the direction opposite arrow T to effect the seal betweenthe door and the contact surface 10230. The drives 10210A, 10210B,10200A, 10200B may be suitably coupled to the links 10204A, 10204B,10203A, 10203B to allow the camming movement of the doors 10130, 10120as described with respect to FIGS. 15A, 15B. In other exemplaryembodiments the doors may be driven within the openings shown in theFigures by two axis drives such that there is substantially no contactbetween the links 10204A, 10204B, 10203A, 10203B and their respectiveopenings. In alternate embodiments the doors may be driven in anysuitable manner.

Referring now to FIGS. 16 and 16A-16C, an exemplary load lock 10100′ isshown in accordance with an exemplary embodiment. In FIG. 16 the loadlock may be substantially similar to load lock 10100 described above(unless otherwise noted) and is shown in part of a substrate processingsystem where the load lock 10100′ is coupled to a processing module10300. In this example the load lock 10100′ is configured as a singlechamber load lock. In alternate embodiments the load lock 10100′ mayhave any suitable number of chambers. The load lock 10100′ may includechamber 10150′, seal contact surface 10230′, an atmospheric door 10320and drive modules 10310, 10330. As noted above the drive modules 10310,10330 are located outside of the substrates transfer zone 10110 as canbe seen in FIG. 16A. The drive modules 10310 and 10330 may includedrives 10310A, 10330A and openings 10302. The drives 10310A, 10330A maybe substantially similar to drives 10200A, 10200B, 10210A, 10210Bdescribed above. It is noted that in other exemplary embodiments, asdescribed above with respect to FIGS. 14A-E and 15, the load lock 10100′may have one drive on either side of the door that supports and effectsmovement of the door 10320 while a passive bearing may be located on theother side of the door for supporting and allowing movement of the door10320. The openings 10302 may be substantially similar to openings10201-10204 described above. In this example, the links 10304, which aresubstantially similar to links 10204A, 10204B, 10203A, 10203B describedabove, may couple the atmospheric door 10320 to the drives 10310A,10330A through the slots 10302 in any suitable manner, such as in themanner described above. In alternate embodiments the door 10320 may becoupled to the drives 10310A, 10330A in any suitable manner. It is notedthat the load lock 10100′ may also include a vacuum valve or door 10321that may be substantially similar to door 10320 and operate in asubstantially similar manner as that described with respect to door10320. In alternate embodiments, the vacuum valve or door 10321 may haveany suitable configuration.

Referring now to FIGS. 17 and 18 an exemplary load lock 20100 is shownin accordance with an exemplary embodiment. In this example, the loadlock 20100 is configured as a right angle load lock in that theatmospheric interface 20101 is located at substantially ninety-degreesin relation to the vacuum interface 20102. In alternate embodiments theload lock may have any suitable configuration where the atmosphericinterface 20101 has any suitable angular or spatial relationship withthe vacuum interface 20102.

In this exemplary embodiment, the atmospheric interface 20101 of theload lock 20100 includes a load lock door insert 20130, an atmosphericdoor 20120 and a door drive unit 20125. It is noted that the vacuuminterface of the load lock 20100 may be configured in a substantiallysimilar manner to that described with respect to the atmosphericinterface 20101. In alternate embodiments, the vacuum interface may haveany suitable configuration. The door drive unit 20125 is configured to,for example open the atmospheric door 20120 by moving the door away fromthe insert face 20150 substantially in the direction of arrow H1 andthen away from the substrate opening 20140 substantially in thedirection of arrow V1. Referring also to FIG. 20, the drive unit 20125may be configured to close the atmospheric door 20120 in substantiallythe opposite manner. For example, the drive unit may move the door 20120substantially in the direction of arrow V2 such that the door is inlinewith the substrate opening 20140 and then substantially in the directionof arrow H2 to position the door 20140 over the opening 20140. As can beseen in FIG. 17, the drive unit 20125 for the door 20120 is locatedbelow the door 20120 but in alternate embodiments the drive may have anysuitable location relative to the door including, but not limited to,being located on the sides of the door as described above with respectto FIGS. 14A-16C. The drive unit 20125 may be any suitable drive unitincluding, but not limited to, pneumatic, electrical, hydraulic andmagnetic drives. A seal is formed between the door 20120 and the doorinsert face 20150 when the door is brought over the opening by virtue ofa compression of the door seal 20300 against the insert face 20150.

Referring still to FIG. 17 and also to FIG. 20, the atmospheric door20120 may be suitably connected to the drive unit 20125 in any suitablemanner such as by, for example, one or more drive shafts 20126. The door20120 may be suitably sized to fit over the substrate opening 20140 suchthat a portion of the door overlaps the insert face 20150 so that a sealmay be made around the substrate opening 20140. Any suitable seal 20300may be coupled to a perimeter of the door surface 201201 that interfaceswith the insert face 20150. The seal 20300 may be constructed of anysuitable material for providing a seal between the door surface 201201and the insert face 20150.

The door insert 20130 may be inserted into a correspondingly shapedopening 20330 in the surface 20310 at the atmospheric interface 20101 ofthe load lock 20100. Referring now to FIGS. 17-21 the door insert 20130may be constructed of any suitable material including, but not limitedto, metals, plastics, ceramics, composites or any combination thereof.The insert 20130 includes an outer peripheral portion 20350 and an innerchannel portion 20360. The outer peripheral portion 20350 may have anysuitable thickness T for providing wear resistance and protection to theatmospheric interface 20101 of the load lock 20100. The outer peripheralportion 20350 may have a length L and height D (see FIG. 17) of anysuitable size such that the outer peripheral portion extends past theedges of the door 20120 when the door is in the closed position as canbe seen in FIGS. 20 and 21. In other exemplary embodiments, the length Land height D of the outer peripheral portion 20350 of the insert 20130may be of a suitable size such that the insert extends past the doorseal 20300 but not past the door edges. In alternate embodiments theouter peripheral portion 20350 of the insert may have any suitabledimensions. The outer peripheral portion 20350 may have openings 20210spaced around, for example, its outer periphery. The openings may be anysuitable openings that allow the passage of, for example, removablefasteners including, but not limited to, bolts and screws for removablycoupling the insert 20130 to the load lock 20100. In alternateembodiments the insert 20130 may be coupled to the load lock 20100 inany suitable manner including, but not limited to, chemical, magneticand vacuum couplings.

The inner channel portion 20360 may form the substrate opening 20140 forthe passage of substrates into and out of the load lock 20100. As can beseen best in FIG. 17 the opening 20140 formed by the inner channelportion 20360 may have any suitable shape configured to allow thesubstrate and at least an end effector (or a portion thereof) of atransport robot carrying the substrate to pass through the opening20140. In one exemplary embodiment the channel portion 20360 may besized such that minimal clearance is provided between walls of thechannel portion 20360 and the substrate and at least the end effector.The inner channel portion 20360 may project past a back surface 20400 ofthe outer peripheral portion 20350 any suitable distance D2 as can bestbe seen in FIG. 21. In this example the inner channel portion 20360extends to an inner surface 20410 of the load lock chamber 20420. Inalternate embodiments the inner channel portion 20360 may extend beyondor in front of the inner surface 20410 of the load lock chamber 20420.In other alternate embodiments the channel portion 20360 may not extendpast the back surface 20400 of the outer peripheral portion 20350.

The corresponding opening in the surface 20310 of the load lockatmospheric interface 20101 may have an outer recess 20330 and an innerchannel opening 20340. The outer recess 20330 may have a depthsubstantially equal to the thickness T of the outer peripheral portion20350 of the insert 20130 and a length and height larger than the lengthL and height D of the insert 20130 such that sufficient clearance existsaround the outer peripheral portion 20350 of the insert 20130 and therecess 20330 to allow for insertion and removal of the insert 20130 inthe recess 20330. In alternate embodiments the outer recess may have anysuitable dimensions. In still other alternate embodiments the outerrecess may be configured for press or interference fit with the insert20130. The inner channel opening 20340 may be suitably sized so thatsuitable clearance exists between the inner channel opening 20340 andthe inner channel portion 20360 of the insert 20130 to allow for easyremoval and insertion of the insert 20130. In alternate embodiments theclearance may be minimized such that an interference or press fit iscreated when the insert 20130 is inserted in to the outer recess 20330and inner channel opening 20340. As may be realized, although theFigures show the insert 20130 being located in the recess 20330, inalternate embodiments the back of the insert 20440 (See FIG. 21) mayinteract with surface 20310 of the load lock 20100 (e.g. the insert isnot recessed in the surface 20310).

As can be seen best in FIG. 21, the back surface 20400 of the outerrecess 20330 includes a channel 20221 that circumscribes the innerchannel opening 20340. In this example the channel 20221 is locatedbetween inner channel opening 20340 and the openings 20210 for theremovable fasteners. In alternate embodiments the channel 20221 may belocated in any suitable relation with respect to the inner channelopening 20340 and the openings 20210 for the removable fasteners. Instill other alternate embodiments the channel may be located betweeninner channel portion 20360 and inner channel opening 20340. The channel20221 may be configured to accept and retain, for example, an O-ring orany other suitable seal 20220. The seal 20220 may be made of anysuitable material for effectuating a seal between the back surface 20400of the recess 20330 and the insert 20130 when the fasteners, forexample, compress the seal 20420 as the insert 20130 is coupled to theload lock 20100. The seal 20420 may allow the vacuum or other controlledatmosphere inside the load lock 20100 to be maintained when the loadlock 20100 is pumped down or vented. In alternate embodiments wherethere is no recess in the surface 20310 the seal 20420 may be locatedin, for example, the surface 20310 for sealing between the insert 20130and the load lock frame. In other alternate embodiments the vacuuminside the load lock 20100 may be maintained in any suitable manner.

In operation, as the load lock is used, the substrates and/or transferrobots may impact the sealing surface 20150 of the insert 20130 causingscratches in or otherwise damaging the surface 20150. Debris on the doorseal 20300 or worn door seals 20300 may also damage the surface 20150.Faulty door motion may also cause the door to impact the surface 20150causing damage. These scratches and other damage to the surface 20150may cause leakage of the atmosphere within the load lock 20100. Ratherthan dismantle the load lock 20100 from the substrate processing systemand sending the load lock to, for example a machine shop to be repaired,a user of the load lock can remove the damaged insert 20130 and replaceit with a new insert to minimize downtime of the load lock and itsassociated processing equipment. The damaged insert may be constructedso that the surface 20150 can be machined or otherwise repaired so thatthe inserts may be reused.

The removable inserts 20130 described herein provide a fast costeffective way to maintain the atmospheric interface 20101 of, forexample, a load lock 20100 without having to machine or replace the loadlock because of damaged sealing surfaces. The seal 20220 between theinsert 20130 and the load lock 20100 maintains the vacuum or otheratmosphere within the load lock chamber 20420. As may be realized, theremovable inserts described herein may be incorporated into any suitabledoor of a substrate processing system.

As can be seen in FIG. 22 the load lock module 50100 may include a frameor housing 50130 that forms a chamber 50135 (the top of the chamber isremoved for illustrative purposes). In one embodiment the chamber 50135may be isolatable from an external atmosphere and may be capable ofholding, for example, a vacuum or any other suitable controlled or cleanatmosphere. The chamber 50135 may have substrate transport opening(s)50116, 50118 on the sides of the load lock module 50100. The location ofthe transport openings 50116, 50118 shown in the figures is merelyexemplary, and in alternate embodiments the chamber may communicate withopenings in any other desired sides of the modules (such as the adjacentsides). Each transport opening of the chamber(s) may be independentlyclosable by any suitable door/slot valve(s) 50120 (only one of which isshown) for sealing and isolating the chamber 50135 from an externalatmosphere(s). In one exemplary embodiment, a substrate transferapparatus 50110 may be located at least partly within the chamber 50135for transporting substrates S through the module 50100. In otherexemplary embodiments, as will be described below with respect to FIGS.1A and 1B, the load lock module 50100 may not have a substrate transportwhere substrates are placed in and removed from the load lock module bysubstrate transports located in other parts of the processing tool orsystem such as, for example, an equipment front end module and/or vacuumback end. In still other exemplary embodiments the load lock module50100 can include any suitable substrate processing apparatus including,but not limited to, aligners, heaters, coolers and metrology tools.

In this example the transfer apparatus 50110 is shown as having an upperarm 50111 rotatably coupled to a drive section (not shown). In alternateembodiments, the transfer apparatus may have any suitable number ofupper arms. Two forearms 50112, 50113 are rotatably coupled to an end ofthe upper arm 50111 at an elbow joint. In alternate embodiments, thetransfer apparatus may have more or less than two forearms coupled tothe upper arm(s). As may be realized each of the forearms 50112, 50113includes an end effector or substrate holder 50410 (See FIG. 23A)configured for holding one or more substrates. Examples of suitabletransfer apparatus can be found in U.S. patent application Ser. No.11/179,762, entitled “Unequal Link Scara Arm” and filed on Jul. 11,2005; U.S. patent application Ser. No. 11/104,397, entitled “Fast SwapDual Substrate Transport For Load Lock” and filed on Apr. 12, 2005; andU.S. Pat. No. 6,918,731, the disclosures of which are incorporated byreference herein in their entirety. In alternate embodiments thetransfer apparatus 50110 may be any suitable transfer apparatus havingany suitable arm link configuration including, but not limited to,transfer apparatus having bearing drives, self-bearing drives andmagnetically levitated arm segments or links.

As will be described in greater detail below, the module 50100 may beconfigured to maximize the throughput of substrates S that can be passedthrough the module 50100 and the processing tool, of which the module50100 is coupled to, while at the same time minimizing the generation ofparticles that may contaminate those substrates during pump down andventing cycles of the load lock module 50100.

As noted above, the load lock module 50100 may communicate betweendifferent sections (not shown) of a processing tool each for examplewith different atmospheres (e.g. inert gas on one side and vacuum on theother, or atmospheric clean air on one side and vacuum/inert gas on theother. In this example, the load lock module 50100 may define onechamber 50135 therein for holding substrates. In alternate embodiments,the load lock module 50100 may have more than one chamber where, forexample each chamber may be capable of being isolated and capable ofhaving chamber atmosphere cycles that match atmospheres in the toolsections adjoining the module. In the exemplary embodiment the load lockmodule chamber 50135 is compact allowing for rapid cycling of thechamber atmosphere.

Referring now to FIGS. 23A and 23B the load lock module 50130 will bedescribed in greater detail. In one aspect the chamber 50135 isconfigured to have a minimized internal volume with respect to, forexample, the paths of motion of the components within the chamber 50135and/or the path of substrate(s) S passing though the chamber 50135. Inone exemplary embodiment the side walls W1, W2 of the chamber 50135 maybe contoured to follow a path of the substrate S and/or arm link(s)50112 of the transfer apparatus while allowing only a minimal clearancebetween the substrate and/or arm link and the walls W1, W2. As can beseen in FIGS. 23A and 23B, wall W1 is contoured to follow the arcuatemotion of the elbow joint 50460 connecting the upper arm 50111 andforearm 50112 of the transfer apparatus 50110. Wall W2, in this example,is contoured to follow a path of an edge of the substrate S as thesubstrate is carried through the load lock module 50130 by the transferapparatus 50110.

In this example, the bottom and/or top of the chamber 50135 may also becontoured to provide only a minimal clearance between the movablecomponents of the load lock module 50100 and the top and/or bottom ofthe chamber 50135. For example, surface of section B1 of the bottom ofthe chamber 50135 may be raised relative to the surface of section B2 ofthe bottom of the chamber 50135 (See FIG. 23C). For example, section B1may only provide clearance for the end effector and substrate seatedthereon while section B2 provides clearance for the upper arm 50111 andforearms 50112, 50113 of the transfer apparatus 50110 in addition toproviding clearance for the end effector and substrate seated thereon.As may be realized the top of the chamber may also be contoured in amanner similar to that described above with respect to the bottom of thechamber 50135. Suitable examples of load lock chambers with contouredinternal surfaces include U.S. patent application Ser. No. 11/104,397,entitled “Fast Swap Dual Substrate Transport For Load Lock” and filed onApr. 12, 2005; and U.S. Pat. No. 6,918,731, previously incorporated byreference and U.S. Provisional Patent Application No. 60/938,913,entitled “Compact Substrate Transport System With Fast Swap Robot” andfiled on May 18, 2007, the disclosure of which is incorporated byreference herein in its entirety. In alternate embodiments the chambermay have any suitable shape and contour for minimizing the internalvolume. As may be realized this minimized internal volume of the chamber50135 minimizes the volume of gas moved into or out of the chamber 50135during the pump down and vent cycles. This reduced volume of gas G mayreduce the cycle times for transferring a substrate(s) through the loadlock module 50100 as less gas G has to be evacuated or introduced intothe chamber 50135.

In one exemplary embodiment, still referring to FIGS. 23A and 23B, asdescribed above, the internal surfaces of the chamber 50135 (i.e. top,bottom and side walls) may be configured to include one or more heatingelements (or surfaces) 50450, 50451. In one embodiment the heatingelements 50450, 50451 may be embedded within one or more walls of thechamber 50135 such that the gas G within the chamber is heated. In thisexample, the gas G within the entire chamber may be heated to, forexample, a substantially uniform temperature. In alternate embodimentsgas G within any suitable portion of the chamber may be heated. In otheralternate embodiments the gas G may not be uniformly heated. As may berealized, in other exemplary embodiments, the heating elements may alsomaintain a temperature of the gas G within the chamber 50135. Forexample, the gas G may be introduced to the internal volume of thechamber through, for example, any suitable flow lines 50455 at apredetermined elevated temperature. In one exemplary embodiment a gassource GS connected to the chamber through the flow lines 50455 mayinclude a gas heater 50456 for raising the temperature of the gas G to apredetermined temperature before the gas G is introduced in the chamber50135. In alternate embodiments the gas G may be heated in any suitablemanner before it is introduced in the chamber 50135.

While only two heating elements 50450, 50451 are shown for exemplarypurposes, it should be realized that the load lock module may includeany suitable number of heating elements. In this example, the heatingelements are suitably located or embedded within the chamber walls forheating the walls of the chamber and hence the gas G therein. In otherexemplary embodiments the walls of the chamber 50135 themselves may bethe heating elements. For example, the surface WS (or any other suitableportion) of one or more walls of the chamber 50135 may be configured asa heating element for transferring heat into the gas within the chamber50135. In alternate embodiments the one or more heating elements may bemodular heating elements that are removably inserted within the chamberwalls. In other alternate embodiments the one or more heating elementsmay be affixed to the surfaces of the chamber 50135 in any suitablemanner. For example, the walls of the chamber may be constructed of aconductive material such as aluminum alloy (or any other suitablematerial for example). The heating elements may be affixed to a surface(interior or exterior) of one or more walls for conductively heating thewalls to a predetermined temperature.

In one exemplary embodiment, the heating elements 50450, 50451 may belocated around the chamber to provide any suitable heating distribution.In one exemplary embodiment the heating elements 50450, 50451 may belocated such that the temperature of the gas G within the chamber issubstantially uniform throughout the chamber 50135. In alternateembodiments the heating elements may be located such that a temperaturegradient is created. For example, the temperature at the bottom of thechamber may be higher than the temperature at the top of the chamber sothat any particles that may be generated within the transport arecarried to the bottom of the chamber. As may be realized a suitablefiltering system may be provided at the bottom of the chamber 50135 tocontain the particles as they flow to the bottom of the chamber via theeffects of the temperature gradient.

The heating elements 50450, 50451 may be any suitable heating elementshaving any suitable configuration. For example, in one exemplaryembodiment the heating elements may be any suitable electric heatingelements. In other exemplary embodiments the heating elements mayinclude conduits within the chamber walls for passing a hot fluidthrough the walls. These heating elements may raise the temperature ofthe walls of the chamber 50135 so that the walls suitably increase thetemperature of the gas within the chamber to minimize particlegeneration during, for example, pump down of the chamber 50135. The gastemperature within the chamber 50135 the during pump down cycle can bedescribed as:T _(GAS) =T ₀+(T _(convection) −T _(adiabatic))  [1]

Where T₀ is an initial gas temperature, T_(adiabatic) is the temperaturedrop due to the gas expansion and T_(convection) is the temperature risedue to heat transfer from the walls of the chamber. The rate of changeof the adiabatic temperature drop can be written as:

$\begin{matrix}{\frac{\mathbb{d}T_{adiabatic}}{\mathbb{d}t} = {\frac{T_{GAS}S_{eff}}{V}\left( {\gamma - 1} \right)}} & \lbrack 2\rbrack\end{matrix}$

where T_(GAS) is the current gas temperature, S_(eff) is the effectivepumping speed, V is the load lock volume and γ is the gas heat capacityratio. In alternate embodiments any suitable equation can be used todefine the adiabatic temperature drop. As can be seen from equation [2],to decrease the rate of change of the adiabatic temperature drop eitherthe pumping speed is decreased or the volume of the chamber is increasedboth of which may result in an increase in pumping time.

Referring now to FIG. 24, an increase in the chamber wall temperatureincreases the amount of heat generated by convection. The rate of changeof the convectional temperature can be described as:

$\begin{matrix}{\frac{\mathbb{d}T_{convection}}{\mathbb{d}t} = {\frac{hS}{\rho\; C_{V}V}\left( {T_{0} - T_{GAS}} \right)}} & \lbrack 3\rbrack\end{matrix}$

where h is the convective heat transfer coefficient, S is the load locksurface area, ρ is the gas density and C_(V) is the gas heat capacity.In alternate embodiments any suitable equation can be used to define therate of change of the convectional temperature. For exemplary purposesonly, if the gas temperature within the chamber during a pump down cycleremains at 20° C., the gas will remain in a zone where no particles aregenerated. As can be seen in FIG. 24, in accordance with anotherexemplary embodiment, the initial gas temperature within the chamberduring a pump down cycle may be increased by, for example, convectionalheat transfer between the walls of the chamber 50135 and the gas G sothat as the gas temperature decreases during adiabatic expansion, thegas temperature does not fall into the zone of particle formation duringpump down at increased or maximized pumping speeds. As can be seen inFIG. 24, the lines L1-L4 represent the gas temperature relative to thepumping time of a pump down cycle for a load lock chamber, such as forexample chamber 50135. As can be seen in FIG. 24, raising the initialgas temperature or otherwise maintaining the gas temperature above theparticle formation temperature (via e.g. the convectional heat transferbetween the chamber walls and the gas) allows for maximized pumpingtimes while remaining in the particle free zone.

As may be realized, in some instances it may be impractical to have veryhigh chamber wall temperatures. In this example, the surface area tovolume ratio of the load lock chamber 50100 may be maximized (in amanner substantially similar to that described above with respect toe.g. FIGS. 23A and 23B) so that optimal convectional heat transfer fromthe heated walls to the gas can occur. Having a maximized surface areato volume ratio of the chamber 50100 and the heated chamber walls mayallow for a load lock having a minimized pump down cycle time whilepreventing the formation of particles within the chamber 50100.

In one exemplary embodiment the load lock chamber 50135 may also beconfigured for a minimized venting cycle time. In one example, theformation of particles and contamination within the load lock chamber50135 during venting may be minimized or prevented by keeping anon-turbulent or laminar flow of gas into the load lock chamber 50135.In one example, the Reynolds number Re for the gas flow may be belowabout 2300. In alternate embodiments, any suitable Reynolds number orflow characteristic may be used. The Reynolds number for any specificventing manifold can be calculated using the following equation:

$\begin{matrix}{{Re} = {\rho\frac{\upsilon\ell}{\eta}}} & \lbrack 4\rbrack\end{matrix}$

where ρ is the density of the gas, υ is the gas velocity, l is thediameter of the flow channel and η is the gas viscosity. In alternateembodiments any suitable equation(s) can be used to determine theReynolds number. In one example the ratio of the gas flow to the maximalgas flow should not be more than 0.5 to 0.6 but in alternate embodimentsthe ratio may have any suitable value. As may be realized the cross overpressure from a soft vent to a fast vent within the chamber 135 may begeometry dependent and could be in the range from about a few torr toabout several hundred torr and may be determined in any suitable mannersuch as, for example, experimentally.

Referring back to FIGS. 1A and 1B another exemplary load lock 100 isshown. The load lock 10 in this example, includes stacked load lockchambers 14A, 14B (two load lock chambers are shown for exemplarypurposes but in alternate embodiments the load lock 10 may have more orless than two chambers). Each of the load lock chambers 14A, 14B may besubstantially similar to the chamber 50135 described above such thateach chamber includes one or more heating elements and has a maximizedinternal surface to volume ratio for effectively heating a gas locatedin each of the chambers. In this example, the load lock chambers 14A,14B do not include a substrate transport, however in alternateembodiments one or more of the chambers 14A, 14B may include a substratetransport. In accordance with an exemplary embodiment, as can be seen inFIGS. 1A and 1B the load lock module 10 may have any suitable number ofvent valves 42A, 42B. While two vent valves 42A, 42B are shown in theFigures it should be realized that there may be more or less than twovent valves. Each of the vent valves 42A, 42B may be modular vent valvesas described above. In alternate embodiments the vent valves may haveany suitable configuration. The vent valves 42A, 42B may be configuredso that high volumetric flow rates of gas can flow through the valvesinto the chamber(s) 14A, 14B with low uniform gas velocities. As may berealized the gas exhausted from ports 50650A, 50650B (which may besubstantially similar to ports 36A′-37B′ as described above with respectto FIG. 7B) may have defined Reynolds number for low speed laminar flowand be configured to avoid particulate deposition on substrate(s) withinthe load lock module 10. In one exemplary embodiment, each of the ventvalves 42A, 42B may include a diffuser/filter 651 installed at anentrance of a venting line to a respective one of the chamber 698, 699.In this example the diffuser 651 is shown as being located at the ports650A, 650B but in alternate embodiments the diffuser may be located atany suitable location relative to the respective chambers 14A, 14B. Thediffuser/filter 50651 may be any suitable diffuser/filter. In oneexample, the diffuser/filter 50651 may be configured to reduce the inletparticle concentration by about nine orders of magnitude with a removalrating of greater than about 0.003×10⁻⁶ m diameter. As may be realized,minimized venting time of the chamber(s) 14A, 14B may be dependent onthe internal volume of the respective chamber(s) 14A, 14B. In oneexemplary embodiment, the internal volume of the chamber(s) 14A, 14B maybe optimized for maximized throughput in a manner substantially similarto that described above with respect to FIGS. 23A and 23B.

Referring now to FIG. 25, an exemplary operation of a load lock module50700 having optimized pumping and venting cycle times will bedescribed. The load lock module 50700 may be substantially similar toload lock module 50100 described above and may include any suitablecombination of the minimized internal load lock volume, heated load lockchamber walls and optimized vent valves as also described above. In thisexample, the load lock module 50700 connects front end module 50720 withthe vacuum back end, which includes vacuum chamber 50710 and processingmodules PM. Here, the load lock module 50700 does not include asubstrate transport but in alternate embodiments the load lock module50700 may include substrate transport. For exemplary purposes,substrates may be transferred from load ports 50725 by a transport50721, located within the equipment front end module (EFEM) 50720, intothe load lock module 50700. The substrates are removed from the loadlock module 50700 by, for example, a transport 50711 in the vacuum backend 50710 and transferred to one or more of the processing modules PM.As may be realized transferring the substrates from the processingmodules PM back to the load ports 50725 may occur in substantially theopposite manner. The transports 50721, 50711 in this example, may beconfigured for the fast swapping of substrates and may include, forexample, multiple transport arms. Suitable transports include, but arenot limited to those described in U.S. patent application Ser. Nos.11/179,762; 11/104,397; and U.S. Pat. No. 6,918,731 previouslyincorporated by reference. Other suitable transfer apparatus includethose described in U.S. Pat. Nos. 5,720,590, 5,899,658, United StatesPublication No. 2003/0223853 and U.S. patent application Ser. No.12/117,355, entitled “Substrate Transport Apparatus” and filed on May 8,2008, the disclosures of which are incorporated by reference herein intheir entirety.

In operation the transport 50721 transfers a substrate(s) into load lockmodule 50700 through an open atmospheric valve coupling the EFEM 50720and load lock module 50700 (Block 50750). The load lock module 50700 isisolated from the EFEM 50720 and is pumped down to vaccum forinterfacing with the vacuum back end 50710 (Block 50751). A slot valvecoupling the load lock module 50700 and the back end 50710 is openedallowing transport 50711 to swap substrate(s) in to/out of the load lockmodule 50700 (Block 50752). The load lock module 50700 is isolated fromthe back end 50710 and is vented for interfacing with the EFEM 50720 asdescribed above (Block 50753). While the load lock module 50700 isinterfacing with the EFEM 50720 the transport 50711 in the back end50710 swaps substrate(s) in to/out of the processing modules PM. Theprocessed substrates are returned to the load lock module 50700 whileunprocessed substrates are taken from the load lock module 50700 insubsequent load lock swap cycles (e.g. Block 50754). As can be seen inFIG. 25, the load lock module 50700 is configured such that the ventingand pumping cycle time 50760 is substantially the same as (or less than)the cycle time for processing a substrate in the back end 50710 which,for example, maximizes substrate throughput through the processing tool50790. In accordance with the exemplary embodiments, the substratesremoved from the processing modules may not have to be buffered beforethey are passed through the load lock 50700 and transported back to, forexample, the load ports (or to any other suitable portion of the tool50790). For example, referring to FIG. 26 a comparison is shown withrespect to a processing tool having a conventional load lock module anda processing tool having a load lock module in accordance with theexemplary embodiments. It is noted that all other parts of theprocessing tools, other than the load lock modules, used for generatingthe chart in FIG. 26 are substantially identical. As can be seen in FIG.26 and for exemplary purposes, throughput of wafers for the conventionalprocessing tool with a conventional load lock module is about 150 wafers(substrates) per hour as represented by line 50800 whereas throughput ofthe processing tool having a load lock module in accordance with theexemplary embodiments is about 200 wafers per hour as represented byline 50810.

In accordance with the exemplary embodiments, the initial temperature ofthe gas within the load lock chamber, before pumping, may besufficiently raised so that as the gas adiabatically expands thetemperature does not fall below a predetermined point where particlesform during pumping of the load lock chamber. The internal volume mayalso be optimized to allow for faster venting times as well as toincreasing the convective heat transfer from, for example, the chamberwalls to the gas within the load lock module to prevent or minimizeparticle generation during pump down. The vent valves of the load lockmodule 50100 may also be optimized to prevent particle formation duringventing as described above. Any suitable combination of these featuresmay allow for higher pumping speeds during the pump down and ventingcycles, which may allow for a higher substrate throughput through theload lock module 100 as described herein.

In one aspect of the disclosed embodiment, a semiconductor processingtool is disclosed. The semiconductor processing tool having a frameforming at least one chamber with an opening and having a sealingsurface around a periphery of the opening, a door configured to interactwith the sealing surface for sealing the opening, the door having sidessubstantially perpendicular to the door sealing surface andsubstantially perpendicular to a transfer plane of a substratetransferred through the opening, and at least one drive located on theframe to a side of at least one of the sides that are substantiallyperpendicular to the door sealing surface and substantiallyperpendicular to the transfer plane of the substrate transferred throughthe opening, the at least one drive having actuators located at leastpartially in front of the sealing surface and the drive actuators beingcoupled to at least one of the sides of the door for moving the door toand from a sealed position. The at least one drive is located outside ofa substrate transfer zone for transferring substrates into and out ofthe at least one chamber through the opening.

It should be understood that the exemplary embodiments may be usedindividually or in any combination thereof. It should also be understoodthat the foregoing description is only illustrative of the embodiments.Various alternatives and modifications can be devised by those skilledin the art without departing from the embodiments. Accordingly, thepresent embodiments are intended to embrace all such alternatives,modifications and variances that fall within the scope of the appendedclaims.

What is claimed is:
 1. A semiconductor processing tool comprising: aframe forming at least one chamber with an opening and having a sealingsurface around a periphery of the opening; a door configured to interactwith the sealing surface for sealing the opening, the door havinglateral sides substantially perpendicular to the door sealing surfaceand substantially perpendicular to a transfer plane of a substratetransferred through the opening; and at least one drive located on theframe at least partially laterally alongside of at least one of thelateral sides that are substantially perpendicular to the door sealingsurface and substantially perpendicular to the transfer plane of thesubstrate transferred through the opening, the at least one drive havingactuators located at least partially in front of the sealing surface andthe drive actuators being coupled to at least one of the sides of thedoor for moving the door to and from a sealed position; wherein the atleast one drive is located outside of a substrate transfer zone fortransferring substrates into and out of the at least one chamber throughthe opening.
 2. The semiconductor processing tool of claim 1, whereindrive links couple the door to the actuators, the drive links beinglocated in front of and substantially parallel to the sealing surface.3. The semiconductor processing tool of claim 1, wherein the actuatorscomprise modular assemblies configured to be removably mounted on theframe.
 4. The semiconductor processing tool of claim 1, wherein theactuators comprise one or two axes of motion and are configured to movethe door away from the sealing surface for moving the door from thesealed position.
 5. The semiconductor processing tool of claim 1 whereinthe door is an atmospheric door or vacuum slot valve.
 6. Thesemiconductor processing tool of claim 1, wherein the sealing surface isremovable from the frame.
 7. The semiconductor processing tool of claim1 further comprising a removeable insert coupled to the frame and atleast one insert seal wherein the frame has a recess and the opening ofthe at least on chamber is located within the recess for accessing arespective one of the at least one chamber, the removable insert havingan outer peripheral portion configured to fit within the recess and aninner channel portion being of unitary construction with the outerperipheral portion and configured to fit at least partially within theopening of the at least one chamber, the outer peripheral portionforming the sealing surface, and the least one insert seal being locatedin the recess and circumscribing each opening of the at least onechamber, least one the at least one insert seal being distinct from theinsert and configured to interact with the insert and form a sealbetween the insert and the frame.
 8. The semiconductor processing toolof claim 7, wherein the at least one chamber is configured to hold acontrolled environment, the insert seal being configured to seal thecontrolled environment from an external environment different from thecontrolled environment.
 9. The semiconductor processing tool of claim 7,wherein the outer peripheral portion extends beyond the periphery of thedoor.
 10. The semiconductor processing tool of claim 7, wherein theopening of the at least one chamber one her is sized to provide minimalclearance for passage of at least one substrate and at least a portionof a transport carrying the at least one substrate.
 11. Thesemiconductor processing tool of claim 1, further comprising: at leastone heating element integrally embedded within walls of the at least onechamber and between inner and outer wall surfaces and configured to heatthe chamber walls.
 12. The apparatus of claim 11, wherein the walls ofthe at least one chamber are contoured to follow a path of a substratethrough the isolatable chamber with minimized clearance between thesubstrate and the walls.
 13. The apparatus of claim 11, wherein thewalls are further configured to maintain an initial gas temperature of agas within the at least one chamber during a pump down cycle such that agas temperature decrease from adiabatic expansion during pump downremains above a predetermined point to minimize particle formationwithin the at least one chamber.
 14. The apparatus of claim 11, furthercomprising a vacuum system configured to pump down the at least onechamber.
 15. The apparatus of claim 11, further comprising at least onevent valve configured to maximize a volumetric flow of gas into the atleast one chamber where the volumetric flow of gas has a low uniform gasvelocity to minimize particle formation during a venting cycle of the atleast one chamber.
 16. The apparatus of claim 15, wherein the at leastone chamber is configured such that a pump down cycle and the ventingcycle occurs within a time for processing a substrate in a processingmodule connected to the at least one chamber.
 17. The apparatus of claim11, wherein an internal volume of the at least one chamber is configuredto minimize venting cycle times of the isolatable chamber.
 18. Theapparatus of claim 11, further comprising a substrate processingapparatus located within the at least one chamber.
 19. The apparatus ofclaim 11, further comprising a vent gas source configured to heat a gasto a predetermined temperature before introducing the gas into the atleast one chamber.
 20. The apparatus of claim 11, wherein the at leastone heating element is arranged to form a temperature gradient withinthe at least one chamber to effect a predetermined direction of particleflow.